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PIKE Technologies

PIKE MappIR II Automated Wafer Mapping Accessory

The PIKE MappIR II is a high-precision automated sampling workstation for semiconductor wafer analysis, delivering rapid multi-point mapping of epitaxial layers, impurities, and dielectric concentrations.

Product Overview

The PIKE MappIR II is a specialized automated sampling accessory designed to integrate seamlessly into the sample compartment of most commercial FTIR spectrometers for the rigorous characterization of semiconductor wafers. It serves as a critical tool for the semiconductor industry, facilitating the precise mapping of epitaxial (EPI) layer thickness, borophosphosilicate glass (BPSG) characterization, and the quantitative determination of interstitial oxygen and carbon content. Supporting wafer sizes from 2 inches (50 mm) up to 8 inches (200 mm), the MappIR II is engineered to meet the high-throughput demands of both industrial quality control and advanced material research.

This redesigned accessory features high-resolution micro-stepper motors that provide exceptional positional repeatability and accuracy across the entire wafer surface. One of its most significant advantages is the intuitive single-slide control knob, which allows operators to switch between transmission and specular reflection measurement modes instantly without hardware reconfigurations. To ensure maximum spectral integrity, the MappIR II includes an integrated purge enclosure that effectively removes atmospheric interference from water vapor and CO2, providing stable and pristine data acquisition for every mapped point.

Controlled by the user-friendly AutoPRO™ software, the system allows for the creation of complex mapping patterns using either Polar or Cartesian coordinates. To protect the sensitive silicon surfaces, wafers are secured using spring-loaded Delrin® retaining clips, ensuring they never come into contact with the aluminum stage. This combination of precision mechanics and sophisticated software makes the MappIR II the premier choice for non-destructive, high-fidelity wafer mapping.

Key Features

  • Automated Multi-Point Mapping: Enables unattended, high-speed measurements of wafers up to 8 inches (200 mm) in diameter.
  • Dual-Mode Versatility: Seamlessly toggles between specular reflection and transmission modes via a single integrated slide control.
  • High Positional Accuracy: Redesigned micro-stepper motors ensure exceptional repeatability for critical thickness and impurity mapping.
  • Integrated Purge Enclosure: Minimizes spectral interference by maintaining a dry, controlled environment during the entire measurement sequence.
  • Advanced AutoPRO™ Software: Features an intuitive graphical interface for setting up customized mapping patterns and real-time experiment monitoring.
  • Contamination-Free Design: Wafers are held by non-marring Delrin® clips to prevent surface contact with the accessory stage.
  • Universal FTIR Compatibility: Precision baseplate-mounted design fits most full-size FTIR instruments, facilitating easy installation and alignment.

Specifications

Wafer Sizes2” (50 mm) to 8” (200 mm) with optional inserts
Angle of Incidence15° (Specular Reflection)
Measurement ModesTransmission and Specular Reflection
Positional Resolution1000 steps/inch (Linear); 6 steps/degree (Angular)
Beam Size1.5X larger than the spectrometer's standard beam size
Purge SystemIntegrated enclosure with nitrogen/dry air lines
Control SoftwareAutoPRO™ (supports Cartesian and Polar coordinates)
MountingStandard sample compartment baseplate

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